Dr. Tresky T-3002FC 3002/3102 8" Die Bonder Pick Place Wafer Ejector

The Dr. Tresky T-3002FC (8" Die Bonder Tresky 3002/3102) is a manual die bonder and component placement system built by Dr. Tresky AG, Switzerland. It is designed for precision die attach and pick-and-place work in semiconductor, MEMS, flip-chip, optoelectronics and R&D micro-assembly applications, and is equipped with a wafer ejector system for die pick-up directly from wafer.

The machine features a manual XY placement stage with fine adjustment, a Z-axis bonding head with vacuum pick-up tool, an 8" wafer holder ring with adjustable ejector needle, a dispensing/stamping unit, two microscope-style illuminators, and a control panel with placement, dispensing and die-bonding modes, adjustable process timers (auto up/Z-lock, puff placement, puff wafer, die delay, scrub) and pneumatic pressure/vacuum gauges with adjustment.

The set includes the original manufacturer documentation: the Tresky user manual (Gebrauchsanleitung Diebonder T-3002FC), the manufacturer's declaration of conformity, and the original operating instructions issued by the previous industrial user (Bosch Telecom GmbH).

The microscope is not included.

The sale includes only the equipment shown in the photos.

Technical data:

• Manufacturer: Dr. Tresky AG, 8800 Thalwil, Switzerland
• Model: T-3002FC / 3002 Version 2 (nameplate: 8" Die Bonder Tresky 3002/3102)
• Serial No.: 00545
• Power supply: 220V
• Interfaces: foot switch, remote control, pneumatic VAC and AIR main connections
• Function: manual die bonding and component placement with wafer ejector for pick-up from wafer
• Made in Switzerland

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