STS 310PC Dual-Frequency PECVD Plasma Deposition System + Leybold Sogevac + PC

STS 310PC Dual-Frequency PECVD Plasma Deposition System

For sale is an STS – Surface Technology Systems 310PC dual-frequency PECVD system, designed for research, development and small-scale production of plasma-deposited thin films.

The actual machine configuration and original documentation confirm that this is a 310PC plasma deposition system, not an RIE etcher.

Main features

• PECVD plasma deposition system
• Dual-frequency RF operation
• High frequency: 13.56 MHz
• Low frequency: 187.5 kHz
• High-frequency, low-frequency and mixed-frequency recipe capability
• RF frequency selection allows adjustment of deposited film properties and film stress
• Manual substrate loading
• Automatic chamber pump-down
• Automated recipe-controlled processing
• Process chamber with heated substrate/electrode assembly
• Confirmed normal process temperature: 300°C
• Capacity: up to 4 × 4-inch wafers per process run

Process capability

The original operating documentation confirms use of the system for deposition of:

• Silicon dioxide – SiO2
• Silicon nitride – SiNx / Si3N4

The original control computer also contains historical process recipes for:

• SiO2
• SiN
• SiON
• HF, LF and mixed-frequency processes

The installed gas connections include:

• SiH4 – silane
• NH3 / N2
• N2O
• CF4 / O2
• N2
• purge gas

The system was previously operated with silane, ammonia/nitrogen, nitrous oxide and CF4/O2 process gases.

Dual-frequency / stress-control capability

The STS 310PC is equipped with:

• 13.56 MHz RF
• 187.5 kHz RF

The system supports:

• HF recipes
• LF recipes
• mixed-frequency recipes

This configuration allows the user to influence deposited film characteristics and stress by changing the RF operating mode.

Loading configuration

This machine is a manual-loading PECVD system.

The process chamber is vented, the chamber lid is opened and the substrate is placed directly onto the electrode assembly.

The system does not have a separate vacuum loadlock.

Included equipment

The system is offered with the equipment shown in the photographs, including:

• STS 310PC process system
• process chamber
• RF and matching electronics
• gas control system
• vacuum system
• Alcatel vacuum equipment
• control computer
• monitor
• original STS Operator's Manual
• original process documentation
• stored historical process recipes

The control computer powers up and the STS 310PC Dual Frequency software starts successfully.

Condition

Used laboratory equipment.

The system has not been connected to process gases and fully process-tested at our facility.

It is therefore offered in its current condition, with the available documentation and accessories shown in the photographs.

An excellent platform for universities, semiconductor research laboratories, MEMS, microfabrication, thin-film development and other PECVD applications.

• Please contact us for additional photographs, technical details, packing and worldwide shipping.

We can pack the system professionally for international transport. Worldwide shipping possible on request. Collection by the buyer or buyer’s freight forwarder is also possible.